Deca Technologies and IBM have signed an agreement to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec. Through the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT™). This collaboration builds on IBM’s strategy to develop its advanced packaging capabilities. IBM…
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