The University of Sheffield Advanced Manufacturing Research Centre (AMRC) Cymru, part of the Innovate UK-funded High Value Manufacturing Catapult (HVMC), has partnered with a world leader in flexible electronics to make reusable packaging systems a reality.
The TRACE (Technology-enabled Reusable Assets for a Circular Economy) project, led by PragmatIC Semiconductor, will use the company’s ultra-low-cost NFC (Near Field Communication Technology), to give reusable containers unique digital identities (UIDs) so packages can be efficiently and effectively returned and reused. The UIDs will be used throughout the lifecycle of the packages: firstly, by…
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